High-Temperature PCBA Baking Process Optimization

Files

Avantika_Arya_Agrawal_2022_bak.pdf (5.73 MB)

Date

2022

Authors

Journal Title

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Volume Title

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Abstract

Description

Keywords

PCBA, PCB, Baking, Moisture, MSD, Delamination, Crack, SMD

Citation

URI

http://hdl.handle.net/10062/83039

Collections

Science and Technology - Bachelor's theses. Kuni 2024