High-Temperature PCBA Baking Process Optimization

dc.contributor.authorAgrawal, Avantika Arya
dc.date.accessioned2022-07-01T11:54:50Z
dc.date.available2022-07-01T11:54:50Z
dc.date.issued2022
dc.identifier.urihttp://hdl.handle.net/10062/83039
dc.language.isoenget
dc.rightsopenAccesset
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectPCBAet
dc.subjectPCBet
dc.subjectBakinget
dc.subjectMoistureet
dc.subjectMSDet
dc.subjectDelaminationet
dc.subjectCracket
dc.subjectSMDet
dc.titleHigh-Temperature PCBA Baking Process Optimizationet
dc.typeThesiset

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