High-Temperature PCBA Baking Process Optimization
dc.contributor.author | Agrawal, Avantika Arya | |
dc.date.accessioned | 2022-07-01T11:54:50Z | |
dc.date.available | 2022-07-01T11:54:50Z | |
dc.date.issued | 2022 | |
dc.identifier.uri | http://hdl.handle.net/10062/83039 | |
dc.language.iso | eng | et |
dc.rights | openAccess | et |
dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 International | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
dc.subject | PCBA | et |
dc.subject | PCB | et |
dc.subject | Baking | et |
dc.subject | Moisture | et |
dc.subject | MSD | et |
dc.subject | Delamination | et |
dc.subject | Crack | et |
dc.subject | SMD | et |
dc.title | High-Temperature PCBA Baking Process Optimization | et |
dc.type | Thesis | et |